Product Overview​​

DOWSIL™ SE 9187 L is a ​​single-component, fast-curing thermal adhesive​​ available in black, clear/translucent, or white formulations. Key attributes include:

• ​​Formulation​​: Based on polydimethylsiloxane (PDMS) with ultra-low viscosity for easy dispensing.
• ​​Curing​​: Room temperature cure (25°C) in 8–72 hours under 30–80% humidity; accelerated by mild heat (<60°C/140°F).
• ​​Certifications​​: UL 94 HB (flammability rating) for black and white variants.
• ​​Color Options​​: Black, translucent/clear, or white for versatile aesthetic and functional applications.

Product Introduction​​

This thermal adhesive combines rapid curing with exceptional flow properties to bond and protect electronic components. Its unique features include:

• ​​Low Volatility​​: Minimized outgassing reduces voids and ensures reliable performance in sensitive environments.
• ​​Flexibility​​: Cures to a soft, elastomeric film (Shore A 17) that absorbs mechanical stress and improves reliability.
• ​​Electrical Performance​​: High dielectric strength (500 V/mil / 20 kV/mm) and volume resistivity (3.0E+15 Ω·cm) for conformal coating and PCB protection.
• ​​Versatility​​: Suitable for potting, encapsulation, and bonding in displays, sensors, and power modules.

Specialized Attributes​​

Enhanced capabilities beyond standard specs:

• ​​Ultra-Low Viscosity​​: 1.1 Pa·sec (1100 cP) enables precise filling of intricate gaps and uniform coatings.
• ​​Controlled Silicone Volatility​​: Meets IPC standards for low volatile organic compound (VOC) emissions.
• ​​Rapid Handling​​: Tack-free surface in ​​8 minutes​​ at 25°C accelerates production workflows.
• ​​Thermal Stability​​: Serviceable from -45°C to 200°C (-49°F to 392°F) with minimal thermal runaway risk.

​​Application Scenarios​​

SE 9187 L is ideal for:

1. ​​Display Assembly​​: Bonding touchscreens, OLED panels, and flexible circuits in consumer electronics.
2. ​​PCB Protection​​: Conformal coating for automotive, industrial, and IoT devices exposed to vibration or moisture.
3. ​​General Potting​​: Encapsulation of sensors, connectors, and microelectronics in automotive and aerospace systems.